Tod Sladek Joins Hesse Mechatronics
Fremont, California, April 2014 – Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, recently announced that Tod Sladek has joined the company as Applications Engineer, Advanced Process Development & Demonstration.
In his new role, Tod will support Hesse Mechatronics’ customer requirements for advanced thin and heavy wire and ribbon bonding applications, demonstrate, install and maintain the company’s wire bonding equipment and train customers to operate and maintain their wire bonders.
Tod has over 30 years of experience with extensive expertise in test design and analysis, and backend semiconductor equipment technology. Prior to joining Hesse Mechatronics, Tod was with Orthodyne Electronics as senior field applications engineer.
“We are very pleased that Tod has joined our team,” said Joseph S. Bubel president of Hesse Mechatronics, Inc. “His expertise and track record for providing top notch support are a perfect fit for our customers’ advanced wire bonding requirements.”
Customers may contact Mr. Sladek by email at firstname.lastname@example.org or by phone at (408) 436-9300.
For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com. For more information on Hesse Mechatronics’ training and applications support services, please e-mail email@example.com. To see wire bonding in action, visit www.wirebonddemo.com.